Industrial Consultancy & Sponsored Research (IC&SR) , IIT Madras
Method for Analysis of Soil Sub-surface
Categories for this Invention
Category – Soil Analysis, Environmental Engineering
Applications– Non-invasive soil analysis, Environmental Impact Assessment, Site Remediation and Land Reclamation
Industry- Civil Engineering, Agriculture and Land Use Management
Market – Global Soil Analysis market size is USD 751.2 million in 2024 and will expand at a CAGR of 6.6% from 2024 to 2031.
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Problem Statement
- Traditional sub-surface investigation methods, like drilling, are invasive, costly, complicated, and yield unreliable results due to poor survey design and under-sampling.
- Existing non-invasive seismic wave methods produce ambiguous shear wave velocity profiles, as multiple theoretical dispersion curves can match field data equally well. There is a requirement for a non-invasive technique that can precisely process and analyze surface wave data.
Technology
- The invention utilizes wavefield modeling to analyze soil by generating and comparing dispersion images from field data and predicted shear wave velocity profiles to ensure accuracy.
- The process involves acquiring field data with multiple receivers, performing dispersion and inversion operations to generate reference dispersion images and shear wave velocity profiles, and iteratively refining these profiles for accurate soil analysis.
- The technique compares predicted and reference dispersion images, repeating the process until a high similarity is achieved, thus ensuring a reliable and accurate shear wave velocity profile.
Key Features / Value Proposition
Enhanced Accuracy:
- Provides precise and reliable shear wave velocity profiles through iterative wavefield modeling and comparison techniques.
Non-Invasive:
- Eliminates the need for disruptive and invasive borehole drilling, minimizing environmental impact and logistical challenges.
Cost Efficiency:
- Reduces costs associated with traditional invasive drilling methods by using non-invasive seismic wave analysis.
Time Savings:
- Accelerates the sub-surface investigation process with rapid surface wave data acquisition and automated verification.
Questions about this Technology?
Contact For Licensing
sm-marketing@imail.iitm.ac.in
ipoffice2@iitm.ac.in
Research Lab
Prof. Tarun Naskar
Department of Civil Engineering
Intellectual Property
- IITM IDF Ref. 2544
- IN 538052 – Patent Granted
Technology Readiness Level
TRL – 5
Technology validated in relevant environment.