Industrial Consultancy & Sponsored Research (IC&SR) , IIT Madras
A System and Method for Efficiently Transferring Heat from a Heat Source
Categories for this Invention
Category – Thermal Management Solutions, Electronics & Circuits
Applications– Electronic cooling systems, Aerospace and Automotive Industries
Industry- Consumer Electronics, Automotive and Transportation
Market – Global Electronic Cabinet Cooling System Market is projected to grow at a CAGR of 3.4%, increasing from USD 550.8 million in 2023 to USD 697.1 million by 2030.
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Problem Statement
- As electronic devices become smaller and more powerful, the heat generated by their components increases, risking performance degradation and device failure.
- Limitations of Traditional Heat Sinks: Conventional solid heat sinks are inefficient and struggle to handle high heat fluxes.
- Furthermore, existing two-phase cooling systems, while addressing either boiling or condensation aspects, are often complex, expensive to manufacture, and may require high maintenance costs.
Technology
- The invention features a boiling plate with longitudinal fins or mini channels on top of the heat source to enhance surface area and bubble dynamics, improving heat transfer efficiency.
- A condensing structure with superhydrophobic-treated hollow fins promotes efficient dropwise condensation, facilitating better heat transfer and return of liquid droplets to the boiling plate.
- The system uses a working fluid that boils and condenses in a continuous cycle, transferring heat from the heat source to the ambient environment through combined boiling, condensation, and convective cooling.
Key Features / Value Proposition
Efficient Heat Transfer
- The system provides efficient heat transfer from a heat source to fin arrays coupled with ambient air or other fluids, enhancing overall device performance.
Superior Condensation Technology
- Utilizes a super hydrophobic inner surface in the condensing structure to promote dropwise condensation, significantly increasing the heat transfer coefficient.
Customizable and Scalable Design
- The dimensions of the boiling plate and condensing structure can be customized and scaled based on specific cooling requirements, making it versatile for various applications.
Cost-Effective Manufacturing
- The system can be fabricated through machining, casting, and 3D printing, offering a cost-effective solution compared to other cooling methods for high heat flux applications.
Questions about this Technology?
Contact For Licensing
sm-marketing@imail.iitm.ac.in
ipoffice2@iitm.ac.in
Research Lab
Prof. Arvind Pattamatta
Prof. Pallab Sinha Mahapatra
Department of Mechanical Engineering
Intellectual Property
- IITM IDF Ref. 2503
- IN 468268 – Patent Granted
Technology Readiness Level
TRL – 4
Technology validated in lab scale.