Industrial Consultancy & Sponsored Research (IC&SR) , IIT Madras
A System and Method for a Heat Transfer Device with enhanced efficiency and thermal management
Categories for this Invention
Technology: System and Method for a Heat Transfer Device;
Industry & Applications: Petrochemical, Electric Power & Metallurgy, Shipbuilding Industry
Market: The global heat transfer equipment Market is projected to grow $21.40B at a CAGR of 4.4% during the period (2024-31).
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Problem Statement
- Generally, thermal management plays a vital role in maintaining optimum operating temperatures for components such as lithium-ion batteries in electric vehicles, where excess heat can negatively impact performance and lifespan.
- Further, existing systems do not succeed in adequately addressing the heat dissipation requirements of these advanced technologies and often fall short of efficiently managing the high heat fluxes generated by modern electronic devices.
- Other existing systems have tried to address said problem.
- Present invention addresses above issues in efficient manner.
Technology
- Present invention describes a heat transfer device and method designed for efficient thermal management & high heat dissipation.
- (Refer figs 1 & 2)
- It consists of a flat plate with mini channels forming a closed loop for a working fluid to flow through.
- A heat dissipation unit is connected to the flat plate to transfer heat to the environment.
- The mini channels have a super hydrophilic coating to enhance thin film evaporation & boiling heat transfer.
- The device further comprises a heat source & the mini channels which can have different shapes. (Refer fig 3)
- A cover plate is attached to the flat plate to create a vacuum-tight seal. There’s also a port for filling and evacuating the working fluid & a sensor unit to monitor temperature & pressure.
- Various working fluids can be used.
Key Features / Value Proposition
Technical Perspective:
Efficient Techniques:
- The claimed invention enabling enhanced performance, improved reliability, and extended lifespan for electronic components and energy storage systems.
- Facilitates improved heat dissipation & thermal regulation in energy-intensive devices.
Heat Transfer Device:
- The claimed heat transfer device that utilizes liquid-vapour phase change, such as boiling and condensation, for efficient heat transfer.
Improved Performance:
- Enhance the overall performance and reliability of electronic components and systems by effectively managing their thermal characteristics.
Other Key Features:
- Additional features like fins, thermal paste, & different types of heat dissipation units can be included.
- The materials used for the device are typically copper or aluminum.
- The inner surface of the mini channels which is coated with a super hydrophilic coating to facilitate thin film evaporation and improve boiling heat transfer process occurring within the mini channels
Test Results (Experimental Data)
- A significant reduction in overall resistance (by 62%) and temperature (by 53ºC) when tested at 200W-240W.
Industrial Perspective:
Utility:
- Provides a versatile heat transfer device that can be implemented in various applications, such as electronic devices, electric vehicles, & other energy-intensive systems.
Questions about this Technology?
Contact For Licensing
sm-marketing@imail.iitm.ac.in
ipoffice2@iitm.ac.in
Research Lab
Prof. Pallab Sinha Mahapatra
Prof. Arvind Pattamatta
Department of Mechanical Engineering.
Intellectual Property
IITM IDF Ref. 2532
IN Patent No. 511897 (Granted)
Technology Readiness Level
TRL-4
Proof of Concept ready, tested and validated in Laboratory