Industrial Consultancy & Sponsored Research (IC&SR) , IIT Madras
Category: Advance Material & Manufacturing /Assistive, Test Equipment & Design Manufacturing
Industry: Manufacturing/Chemical.
Application: Miniaturized metal components used in cameras, vehicle engines, mobile phones, biomedical applications etc.
Market: The global market size of manufacturing to grow from USD 68.51 Billion in 2023 to USD 121.76 Billion by 2033, (CAGR) of 5.92% during the projected period.
The heating assembly heats the metal billet accommodated in the billet slot of the die assembly to the pre-determined temperature and the punch moves into the billet slot to extrude the metal billet in the form of the micro-extruded product and a solid block die is used with no scope of material leakage during the micro extrusion operation.
Prof. Sushanta Kumar Panigrahi
Department of Mechanical Engineering
IITM IDF Ref. 2288
Patent No: IN 530959
TRL – 4
Technology validated in lab scale.