Method for Mask-less Laser-assisted Hybrid Etching for Interdigitated Electrodes in Semiconductor Devices and Device thereof

Categories for this Invention

Category- Electronics and Circuits

Industry Classification:

NIC (2008)- 26101- Manufacture of electronic capacitors, resistors, chokes, coils, transformers (electronic) and similar components
NAICS (2022)- 333242- Thin layer deposition equipment, semiconductor, manufacturing
Applications: Manufacture of semiconductors-organic field-effect transistors (OFETs), interdigitated back contact (IBC) solar cells and communication devices such as antennas, frequency selective surfaces etc
Market drivers:
The Semiconductor Etch Equipment Market size is estimated at USD 23.80 billion in 2024, and is expected to reach USD 34.32 billion by 2029, growing at a CAGR of 7.60%

Image Gallery

Problem Statement

Various approaches, such as subtractive processes and additive processes, are used for the fabrication of micro-channels or micro scribing on copper films.
However subtractive techniques such EDM and ECM have limitations in terms of minimum achievable feature size and micro-tool fabrication respectively.
Additive techniques such as laser additive manufacturing and vapor deposition techniques require masks and are prone to chamber contamination.
Photolithography and chemical etching techniques have limited scope due to use of masks and toxic nature of etchants respectively.
there is need for a system and method for mask-less etching which is reliable and does not suffer from the problems discussed above.

Technology

Submerging a metal film to be etched in a neutral salt solution.
Applying a voltage to an electrode unit, below a threshold voltage.
Focusing a laser beam through the electrode unit onto the metal film.
Irradiating the laser beam onto the metal film to increase the temperature around the ablation zone, along with laser ablation of the metal film
Triggering mobility of metal ions in the neutral salt solution for achieving selective chemical etching
Achieving hybrid mask-less removal of material from the metal film through laser ablation and laser-activated selective chemical etching

Key Features / Value Proposition

The developed hybrid micro-scribing technique is helpful in micro-scribing Cu film on a dielectric insulator without thermal damage to the dielectric substrate.
The developed method is mask-less and uses non-toxic reagents. Whereas, conventional methods require micro-tool fabrication or mask-based methods with toxic chemicals.
Overall, the device demonstrated a decent transistor characteristic with acceptable leakage current levels. The field-effect saturation mobility was estimated to be around 10-6 cm2/V s.
The proposed laser-assisted hybrid scribing is a promising technique for fabricating electrodes for semiconductors. The method is flexible, cost effective and environmental friendly.

Questions about this Technology?

Contact For Licensing

sm-marketing@imail.iitm.ac.in

ipoffice2@iitm.ac.in

Research Lab

Prof. Nilesh Jayantilal Vasa

Department of Engineering Design

Prof. Soumya Dutta

Department of Electrical Engineering

Intellectual Property

IITM IDF Ref.2268
IN 499893Patent Granted

Technology Readiness Level

TRL 4

Technology Validated in Lab

error: Content is protected !!