Industrial Consultancy & Sponsored Research (IC&SR) , IIT Madras
3-D Interface Augmented Ultrathin Transparent and Conductive Metal Layer Supported on Substrates and Methods of Fabrication
Technology Category/Market
Category- Optoelectronics
Applications– Optoelectronics, plasmonics, solar cells, photovoltaic cells, organic light emitting diodes, integrated electro optic modulators, laser displays, photo-detectors.
Industry-Optoelectronics and Electronics Manufacturing
Market – Global thin and ultra-thin films market is expected to reach USD 22,812.53 million by 2029, registering a CAGR of 15.4% during 2022-2029.
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Problem Statement
- Transparent electrodes (TEs) are crucial in optical devices but ITO, a commonly used material, has limitations including high cost, fragility, and chemical incompatibility.
- Alternative materials like graphene, carbon nanotubes (CNTs), and metal nanowires face challenges like non-uniform properties and rough surfaces.
- Ultrathin noble metal films (<20 nm) offer good optoelectrical properties but suffer from non-continuous growth and increased surface roughness, reducing optical transmittance and conductivity.
- Surface roughness due to in-built substrate roughness and interfacial energy mismatch hinders the formation of continuous ultrathin high conductive metal films.
Technology
- The present invention relates to electrically conductive and transparent ultrathin film comprising a filler material (FM) and high conductive metal (HCM) film supported on substrate.
- It is further disclosed a method of producing stable Ultrathin High conductive Metal (HCM) films comprising of following steps: a) thermal treatment b) FM deposition c) thermal treatment and d) HCM deposition and e) thermal treatment.
- The present disclosure aims to provide the electrodes with better electrical conductivity, optical transparency, stability and compatibility with the environment.
Key Features/Value Proposition
Enhanced Electrode Performance:
- Continuous, smooth metal film layer serves as a superior electrode with improved electrical conductivity and optical transparency, enhancing overall device performance.
Industrial Scalability:
- Easy integration into large-scale industrial processes facilitates cost-effective deposition of these advanced electrodes.
High-Temperature Resilience:
- The assembly, consisting of substrate, FM, and HCM, can withstand annealing at temperatures up to 90% of the melting point (in Kelvin) of any of its three components, ensuring stability in high-temperature environments.
Broad Spectral Transparency:
- The assembly is transparent to visible light and reflective to electromagnetic light in the IR spectral range, making it versatile for various optical applications
Efficient Heat Transfer:
- The 3-D interface between the substrate and HCM, facilitated by FM, promotes better heat transfer, enhancing device performance and longevity.
Anti-Diffusion Barrier:
- FM acts as a barrier layer, preventing the diffusion of Ultrathin HCM into the substrate, ensuring long-term stability and reliability.
Questions about this Technology?
Contact for Licensing
Research Lab
Prof. Satyesh Kumar Yadav,
Department of Metallurgical and Materials Engineering
Intellectual Property
- IITM IDF Ref. 2483
- IN 202241077010
Technology Readiness Level
TRL – 4
Technology validated in lab scale.