Industrial Consultancy & Sponsored Research (IC&SR) , IIT Madras
A Modular Micro-Bending Apparatus
Categories for this Invention
Technology: Micro-bending apparatus;
Industry & Application: Automotive & aerospace industries, Semiconductor, telecommunications sectors, electronics & medical device; & etc.
Market: The global bending machine market is projected to grow USD 2.40Bn, at a CAGR of 5.27% during the forecast period (2024-32)
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Problem Statement
- In the present subject matter, the technical problem is described that how to develop a micro-bending tool with a spring back control mechanism which can be integrated with techniques of microscopic characterization (such as SEM/EBSD) and macroscopic characterization (like Digital Image Correlations (DIC)).
- Present invention provides solution by addressing the issues in efficient manner.
Technology
- Present patent describes a high-precision microbending apparatus having a modular design, capable of bending sheet metal for room temperature as well as high temperature applications. (Refer Fig.1)
- Said micro-bending apparatus comprises a micro-bending punch, a microbending die, a heating assembly including other associate parts.
- Facilitates a modular microbending apparatus having components capable of being easily changed to accommodate various product shapes and sizes.
- Benefits a modular tool design with interchangeable sets of micro-punches and microdies to perform (U, V, W-bending) at room temperature/high temperature in a single tool.
- Disclosed patent describes intelligently designed micro-bending tool which can be integrated with a SEM (scanning electron microscope) and EBSD (electron backscatter diffraction) set-up (Refer Fig.2)
- The tool design enables the use of a spring back control system in which the punch & the die (as a set) can be locked in any user defined position in the loading cycle during the micro-bending operation.
Key Features / Value Proposition
Technical Perspective:
Important Features:
- The material selection for the current tool has been done by keeping in mind its integration with induction heating facility. Induction heating helps in instantly heating the workpiece to the desired temperature during the micro-bending operation up to 500°C.
- All kinds of materials including metals, alloys, polymers, ceramics, and composites materials can be subjected to micro-bending operation.
- The part provided with cooling channels are critical to maintain tight dimensional tolerance during high temperature micro-bending operation.
- The cooling channels are connected to a chiller unit which enables forced heat dissipation out of the tooling system. Said feature restricts the heat from damaging the load sensors & the actuator.
Industrial Perspective:
- The aspect of the tool design makes it an economical option for in-situ microstructural characterization in electron microscopy.
Utility
- Applicable in Instrumentation market area in Telecommunication, Aerospace & Defense, Automotive & Transportation, Electronics & Semiconductor, Medical Devices & etc..
Questions about this Technology?
Contact For Licensing
sm-marketing@imail.iitm.ac.in
ipoffice2@iitm.ac.in
Research Lab
Prof. Sushanta Kumar Panigrahi
Department of Mechanical Engineering.
Intellectual Property
IITM IDF Ref. 2486
IN Patent No. 489056 (Granted)
Technology Readiness Level
TRL-4
Proof of Concept ready, tested and validated in Laboratory