Method for obtaining textured ceramics

Technology: Textured ceramics;

Industry & Application: Optoelectronics, Microelectronics applications, LED/Laser diode;

Market: The global ceramic market is projected to grow at a CAGR of 8.49% during 2024-2032.

In general, Ultra High Temperature Ceramics (UHTC) have very high melting points, the only method to fabricate components is by using powder metallurgy.
In order to synthesize dense compact of UHTC using pressure-less sintering, temperatures in excess of 2050°C is required, while usage of vacuum hot pressing can reduce the temperatures down to 1900°C.
The use of such sintering conditions often leads to uncontrolled grain growth & deterioration of mechanical properties.
Hence there is a need for new processes to overcome above issues.

Present invention describes a method for obtaining textured fine grain UHTC diboride compacts from elemental powders using SPS, wherein the compacts can be obtained at a temperature of 1200°C. (Refer Fig. 1)
Said elemental powders are Zirconium (Zr) and amorphous Boron (B).
Textured ceramic formed by open die forging is ZrB2. Said elemental powders are Titanium (Ti) and Boron (B).
Further, said method for obtaining textured ceramics, comprising a few steps described hereinbelow:

Technical Perspective:

The compact prepared by the proposed method is having a relative density which is greater than 98%, using Archimedes density measurement.
The ceramic compacts is having an elastic modulus greater than 530 GPa, hardness greater than 24 GPa & moderate fracture toughness of 2.6 MPa.m 1/2 at room temperature.
The proposed method is simpler & requires lower temperature of 1600˚C & a pressure of 40 MPa for producing textured compacts.
The total processing time involved in the texturing process is less than an hour.
Facilitates faster fabrication of textured UHTC compacts.
Easily useful for producing highly textured UHTC discs.
The XRD patterns confirm strong basal texture formation in compacts of both TiB2 & ZrB2 respectively. (Figs 2a-2b)
Textured UHTCs can be produced by open die forging using SPS equipment which is possible due to the fine grain size of the compact prepared through the reactive sintering process. (Refer Figs. 4a, 4b)

Industry Perspective:

Said method is simple, cost-effective & easily adopted by any industry.
Claimed method can be implemented using commercially available spark plasma sintering equipment.
Said method requires significantly lower temperature & time to prepare dense compact.
Provides high energy efficiency.
Applicable in the area of optoelectronic & microelectronic applications such as LED/Laser diode.

Prof. Srinivasa Rao Bakshi

Prof. Murty B S

Department of Metallurgical and Materials Engineering

TRL-4

Proof of Concept ready, tested in lab.

Technology Transfer