Industrial Consultancy & Sponsored Research (IC&SR) , IIT Madras
Method for obtaining textured ceramics
Categories for this Invention
Technology: Textured ceramics;
Industry & Application: Optoelectronics, Microelectronics applications, LED/Laser diode;
Market: The global ceramic market is projected to grow at a CAGR of 8.49% during 2024-2032.
Image Gallery
Problem Statement
- In general, Ultra High Temperature Ceramics (UHTC) have very high melting points, the only method to fabricate components is by using powder metallurgy.
- In order to synthesize dense compact of UHTC using pressure-less sintering, temperatures in excess of 2050°C is required, while usage of vacuum hot pressing can reduce the temperatures down to 1900°C.
- The use of such sintering conditions often leads to uncontrolled grain growth & deterioration of mechanical properties.
- Hence there is a need for new processes to overcome above issues.
Technology
- Present invention describes a method for obtaining textured fine grain UHTC diboride compacts from elemental powders using SPS, wherein the compacts can be obtained at a temperature of 1200°C. (Refer Fig. 1)
- Said elemental powders are Zirconium (Zr) and amorphous Boron (B).
- Textured ceramic formed by open die forging is ZrB2. Said elemental powders are Titanium (Ti) and Boron (B).
- Further, said method for obtaining textured ceramics, comprising a few steps described hereinbelow:
- Moreover, Textured ceramic formed by open die forging is TiB2.
Key Features / Value Proposition
Technical Perspective:
- The compact prepared by the proposed method is having a relative density which is greater than 98%, using Archimedes density measurement.
- The ceramic compacts is having an elastic modulus greater than 530 GPa, hardness greater than 24 GPa & moderate fracture toughness of 2.6 MPa.m 1/2 at room temperature.
- The proposed method is simpler & requires lower temperature of 1600ËšC & a pressure of 40 MPa for producing textured compacts.
- The total processing time involved in the texturing process is less than an hour.
- Facilitates faster fabrication of textured UHTC compacts.
- Easily useful for producing highly textured   UHTC discs.
- The XRD patterns confirm strong basal   texture formation in compacts of both    TiB2 & ZrB2 respectively. (Figs 2a-2b)
- Textured UHTCs can be produced by open die forging using SPS equipment which is  possible due to the fine  grain size of the  compact  prepared through the reactive  sintering process. (Refer Figs. 4a, 4b)
Industry Perspective:
- Said method is simple, cost-effective & easily adopted by any industry.
- Claimed method can be implemented using commercially available spark plasma sintering equipment.
- Said method requires significantly lower temperature & time to prepare dense compact.
- Provides high energy efficiency.
- Applicable in the area of optoelectronic & microelectronic applications such as LED/Laser diode.
Questions about this Technology?
Contact For Licensing
sm-marketing@imail.iitm.ac.in
ipoffice2@iitm.ac.in
Research Lab
Prof. Srinivasa Rao Bakshi
Prof. Murty B S
Department of Metallurgical and Materials Engineering
Intellectual Property
IITM IDF Ref. 1372
IN Patent No: 478715
Technology Readiness Level
TRL-4
Proof of Concept ready, tested in lab.